[Webstore-china] Building the IoT: Critical Device-Level Technologies

IoT International Conference mail at iotinternational.net
Fri Nov 11 09:54:25 UTC 2016


Internet of Things International Conference 2017

"Building the IoT: Critical Device-Level Technologies"
Speaking, delegate and sponsorship opportunities available

The inaugural IoT International conference 2017 will provide an in-depth understanding of IoT device-level design requirements, system on chip (SoC) needs, protocols, networks, security and sensor development. Most importantly, the program will reveal ways that a company and products may be part of the IoT opportunity. The presentations are divided into five key themes which collectively provide complete coverage of building the IoT from a critical device-level technologies perspective.

Five key industry themes - 25 inspiring presentations - Save the date!

         • Device technologies and the IoT business

         • IoT sensors

         • IoT security

         • IoT device-level R&D, manufacturing and supply chain

         • IoT diversity: The billion dollar 'niche'



Co-located with      and   


These 2-day events will see 3 groups of device makers gathered under one roof.
During networking everyone will have the opportunity to connect with each other. We expect over 500+ delegates who can attend any one of the 95 presentations on offer.

87 speakers CONFIRMED and in place so far.

IoT International
<http://tracking.bitmagazine.net/tracking/click?msgid=9BJkRby0molNgK9_93H1rA2&target=http%3a%2f%2fwww.iotinternational.net%3e&v=Us1ZaKUCHLfYhr8q-PEtUQ2

Speakers include: IHS Markit, Qorvo, CommSolid GmbH, Weightless SIG, IHS Markit Sensors, Advanced Epi Materials and Devices, imec, Intrinsic-ID B.V., Lux Research, Wirepas Pino, oneM2M, Kinetics, The Alliance for Internet of Things Innovation (AIOTI), Texas Instruments Benelux B.V, Evertracker GmbH, Enfucell Oy, Xilinx, IBM Watson, Gemalto, Versasense; 
and more to come.

CS International
<http://tracking.bitmagazine.net/tracking/click?msgid=9BJkRby0molNgK9_93H1rA2&target=http%3a%2f%2fwww.cs-international.net%2f%3e&v=-9Fae92nKAXpMORPgYN5_Q2

Speakers include: Skyworks, FLOSFIA, VisIC, Exagan, ARPA-E, Monolith, FINsix, Wolfspeed, Sanan Optoelectronics, Philips Lumileds Lighting, OSRAM, Sony, WIN Semiconductors, DARPA, MIT, IBM, Institute of Microelectronics of Chinese Academy of Sciences, Murata Manufacturing, EpiGaN, Seren Photonics, Yole Développement, Teledyne Technologies, University of Rome Tor Vergata, Wolfspeed, MACOM, Evatec, Nanyang Technological University, imec, Aixtron, Ferrotec, Nanotronics, Panasonic, Advanced Epi Materials and Devices.

PIC International
<http://tracking.bitmagazine.net/tracking/click?msgid=9BJkRby0molNgK9_93H1rA2&target=http%3a%2f%2fwww.picinternational.net%2f%3e&v=tEiwEG0Y0ao19meqjEMcgA2

 Speakers include: Infinera, Ciena, Huawei Technologies, Oclaro, Seagate, Intel Corporation, Kaiam, LioniX International, POET Technologies, Luxtera, Cadence Design Systems, University of Southampton, Hewlett Packard Enterprise, Gent University, VTT Technical Research Centre of Finland, Phosnet Research Group - Aristotle University of Thessaloniki, LIGENTEC, Fraunhofer HHI, Tyndall National Institute, VPIphotonics, Technobis group, imec, European Space Agency, PhotonDelta, MIT.




Be a part of it - speaking and sponsoring opportunities available


 Speaking opportunities:Contact Jackie Cannon
<mailto:jackie.cannon at angelbc.com>

 Sponsorship information:mediapack.iotinternational.net
<http://tracking.bitmagazine.net/tracking/click?msgid=9BJkRby0molNgK9_93H1rA2&target=http%3a%2f%2fmediapack.iotinternational.net%2f%3e&v=612lK8XPcn_Gxg4OaHe7iQ2


									
<http://tracking.bitmagazine.net/tracking/click?msgid=9BJkRby0molNgK9_93H1rA2&target=http%3a%2f%2fmediapack.iotinternational.net%2f%3e&v=612lK8XPcn_Gxg4OaHe7iQ2
 Early bird registration:www.iotinternational.net/register
<http://tracking.bitmagazine.net/tracking/click?msgid=9BJkRby0molNgK9_93H1rA2&target=http%3a%2f%2fwww.iotinternational.net%2fregister%3e&v=T1t8DcLtfVbSXZxKrmrdqg2


The sponsor packages provide companies with an influential industry platform to educate and penetrate the global industry by a multitude of marketing methods.
 
Europe & Asia
Jackie Cannon - Event Director

                                              Tel: +44 (0)1923 690 200

                                          Email: jackie.cannon at angelbc.com
<mailto:jackie.cannon at angelbc.com>

USA
Janice Jenkins - Account Manager

									          Tel: +1 724 929-3550

								          Email: jjenkins at brunmedia.com
<mailto:jjenkins at brunmedia.com>




From the publishers/organisers of
                              	 




 
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