[edk2-devel] [edk2-platforms] [RFC] Migrate devel-MinPlatform branch to master branch

Kubacki, Michael A michael.a.kubacki at intel.com
Sat May 4 00:32:46 UTC 2019


Hi Leif,

We should have a single Maintainers.txt at the root of the repository.
Usually maintainers are defined at package scope and that is the case
for the following two Maintainers.txt documents that need to be merged
into the pre-existing edk2-platforms/Maintainers.txt.

 * https://github.com/lgao4/edk2-platforms/blob/master/Platform/Intel/Maintainers.txt
 * https://github.com/lgao4/edk2-platforms/blob/master/Silicon/Intel/Maintainers.txt

However, maintainers are not currently defined at package-level scope
in the current edk2-platforms/Maintainers.txt so merging the package
maintainers into the document leads to confusion. Can we update
edk2-platforms/Maintainers.txt to have per-package maintainers?

That would make it more aligned with edk2/Maintainers.txt and make
adding the new package maintainers straightforward.

Regards,
Michael

> -----Original Message-----
> From: Kubacki, Michael A
> Sent: Thursday, May 2, 2019 2:16 PM
> To: Leif Lindholm <leif.lindholm at linaro.org>; devel at edk2.groups.io
> Cc: Gao, Liming <liming.gao at intel.com>; Andrew Fish <afish at apple.com>;
> Laszlo Ersek <lersek at redhat.com>; Kinney, Michael D
> <michael.d.kinney at intel.com>; Ard Biesheuvel <ard.biesheuvel at linaro.org>
> Subject: RE: [edk2-devel] [edk2-platforms] [RFC] Migrate devel-MinPlatform
> branch to master branch
> 
> Hi Leif,
> 
> > -----Original Message-----
> > From: Leif Lindholm [mailto:leif.lindholm at linaro.org]
> > Sent: Thursday, May 2, 2019 8:04 AM
> > To: devel at edk2.groups.io; Kubacki, Michael A
> > <michael.a.kubacki at intel.com>
> > Cc: Gao, Liming <liming.gao at intel.com>; Andrew Fish <afish at apple.com>;
> > Laszlo Ersek <lersek at redhat.com>; Kinney, Michael D
> > <michael.d.kinney at intel.com>; Ard Biesheuvel
> > <ard.biesheuvel at linaro.org>
> > Subject: Re: [edk2-devel] [edk2-platforms] [RFC] Migrate
> > devel-MinPlatform branch to master branch
> >
> > Hi Michael,
> >
> > On Thu, Apr 18, 2019 at 09:11:38PM +0000, Kubacki, Michael A wrote:
> > > Hello,
> > >
> > > This RFC proposes moving the content on the devel-MinPlatform branch
> > > in the edk2-platforms repository to the master branch in the
> > > edk2-platforms repository.
> > >
> > > The devel-MinPlatform branch has been used for the initial
> > > development of an EDK II based platform design referred to as "Minimum
> Platform".
> > > This design is intended to provide a structured approach to
> > > introducing Intel platform code into open source in a consistent manner.
> > >
> > > For more information about the EDK II Minimum Platform, please refer
> > > to the Readme.md in devel-MinPlatform.
> > > https://github.com/tianocore/edk2-platforms/blob/devel-
> > MinPlatform/Rea
> > > dMe.md
> > >
> > > The following packages would be added in Platform/Intel:
> > >   * Generic packages:
> > >      * AdvancedFeaturePkg
> > >      * MinPlatformPkg
> >
> > First a generic comment with some examples:
> > Both of these include non-architecture-specific components that could
> > be useful to have more generally available.
> >
> > Certainly AdvancedFeaturePkg/Smbios/ and AcpiDebug look like something
> > of a generic nature rather than Intel-platform specific.
> >
> The intention is for advanced features to be generic and architecture
> agnostic when possible. We ultimately want to simplify the process to enable
> open source edk2 platforms and cross-architecture compatibility certainly
> aids in that goal. We're starting with the code in the Intel directory and we
> are open to moving features elsewhere based on interest and usefulness.
> 
> I suspect we'll also evolve some elements of how these features are
> organized and designed based on feedback over time. For example, while
> we're starting with one AdvancedFeaturePkg, it may be too monolithic.
> More cohesive packages are likely easier to integrate and maintain. So we
> may propose breaking this into something like DebugFeaturePkg,
> IoFeaturePkg, PowerManagementFeaturePkg, or to some other degree. I
> expect the definition to be a fluid process based on actual demand.
> 
> > And Platform/Intel/MinPlatformPkg/Library/CompressLib/CompressLib.c
> > appears to have nearly only whitespace differences compared to edk2
> > ShellPkg/Library/UefiShellDebug1CommandsLib/Compress.c.
> >
> > (With edk2 already having 3 additional quite similar files in
> > BaseTools/Source/C/Common/EfiCompress.c
> > BaseTools/Source/C/Common/TianoCompress.c
> > BaseTools/Source/C/TianoCompress/TianoCompress.c)
> >
> >
> That's a good point. In particular, it would be nice to consolidate the code
> usage between ShellPkg and MinPlatformPkg. Perhaps the compression code
> could be moved somewhere like MdePkg where it could be used by both
> packages.
> 
> > Secondly - edk2 has recently transitioned to bsd+patents license, and
> > it would make sense if edk2-platforms did the same. Do we want to do
> > that before or after this addition?
> >
> I will defer this to Mike Kinney.
> 
> >
> > Finally, what should we do for Maintainers.txt?
> >
> I believe we need to have per-package maintainers for the packages being
> added. For example, merge what is in https://github.com/lgao4/edk2-
> platforms/blob/master/Platform/Intel/Maintainers.txt
> 
> I can update the following Maintainers.txt with a proposal.
> https://github.com/lgao4/edk2-platforms/blob/master/Maintainers.txt
> 
> Regards,
> Michael
> 
> > Best Regards,
> >
> > Leif
> >
> > >   * Board-specific packages:
> > >      * ClevoOpenBoardPkg
> > >      * KabylakeOpenBoardPkg
> > >      * PurleyOpenBoardPkg
> > >
> > > The following packages would be added in Silicon/Intel:
> > >  * KabylakeSiliconPkg
> > >  * LewisburgPkg
> > >  * PurleyRcPkg
> > >  * PurleySktPkg
> > >
> > > The following growth is expected over time:
> > >  * Platform/Intel - Additional board packages for Intel reference boards
> > >     including support for some pre-existing product releases
> > >  * AdvancedFeaturePkg - Additional modular features capable of being
> > used
> > >     in board packages
> > >  * Silicon/Intel - Additional silicon packages roughly keeping 1:1 parity
> > >     with board packages
> > >
> > > We hope the content will enable others to add new board packages and
> > > advanced features over time.
> > >
> > > The result of the change is available here for reference:
> > > https://github.com/lgao4/edk2-platforms
> > >
> > > Regards,
> > > Michael
> > >
> > > 
> > >

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